下载后可任意编辑世界半导体生产机台安全设计验收标准英文版12024 年 5 月 29 日下载后可任意编辑22024 年 5 月 29 日下载后可任意编辑Global Semiconductor Safety Services, LLCSEMI S2-93A Product Safety AssessmentFinal Report世界半导体生产机台安全设计验收标准Applied MaterialsChemical Mechanical Polishing System Model: Mirra TrakCMP 工艺应用材料June 19, 1998Prepared for:Applied Materials3111 Coronado DriveSanta Clara, CA 95054Prepared by:Global Semiconductor Safety Services, LLC1313 Geneva DriveSunnyvale, CA 94089GS3 Job No. 980029GS3 Document No. 980029F232024 年 5 月 29 日下载后可任意编辑42024 年 5 月 29 日下载后可任意编辑Client - Confidential 保密合约The information used to prepare this report was based on interviews with Applied Materials’ engineers. The information was also based on inspections of the Chemical Mechanical Polishing System, Model: Mirra Trak. This information was gathered over the period between February 2, 1998 and February 4, 1998, and during a re-inspection of the system on June 3, 1998. A preliminary assessment of the system was also performed on September 25, 1996 through September 26, 1996 and the results of this evaluation were also used. All observations and recommendations are based on conditions and descriptions of the Chemical Mechanical Polishing System, Model: Mirra Trak, during the time of data collection and upon information made available to Global Semiconductor Safety Services. This report's significance is subject to the adequacy and representative characteristics of the Chemical Mechanical Polishing System, Model: Mirra Trak, and to the comprehensiveness of the tests, examinations and/or surveys made.Reference to Global Semiconductor Safety Services, including reproduction of Global Semiconductor Safety Services’...
