AGREEMENT OF SENSOR MODULE’S MANUFACTURE AND SALES 马来西亚电子元器件产销协议TABLE OF CONTENTS 1. Definitions; Interpretation. 定义与解释1.1. Definitions. 定义1.2. Terms Elsewhere Defined; Plurals. 其他定义、复数1.3. Schedules. 本协议附件2. Manufacturing; Exclusive Rights. 产品制作、独家销售权2.1. Manufacturing. 产品制作2.2. Other Products. 其他产品2.3. Exclusive Rights. 独家权利3. Terms of Sale. 销售条款4. Quality. 产品质量5. Engineering Services. 技术服务6. Audit and Access Rights. 审计和获得审计文件的权利6.1. Audit. 审计6.2. Access to Facilities. 从相关分支机构获取资料7. Intellectual Property and Licenses. 知识产权与许可7.1. Ownership. 所有权7.2. No Other Grants. 无其他授权8. Warranties; Out of Warranty Repair. 服务承诺与保修期届满后的维护8.1. Manufacturing. 对产品制作的承诺8.2. Remedy. 对不合格产品的补救措施8.3. Limited Remedy; Exception. 补救措施的限制范围及例外情况的处置8.4. Intellectual Property. 知识产权8.5. Compliance with Laws. 遵守法律8.6. Out of Warranty Repair. 保修期届满后的维护8.7. Parts Availability. 零配件的供应9. Indemnification. 保障和保护责任10. Limitation of Liability. 责任限制11. Term and Termination. 协议有效期与终止11.1. Term. 有效期11.2. Renewal. 协议续期11.3. Termination. 协议终止11.4. Effect of Termination. 协议终止后有关条款的效力11.5. Survival. 效力持续12. Confidentiality Obligations. 保密义务12.1.Confidential Information. 保密信息12.2.Return, Employees. 保密资料的返还与对其雇员的责任12.3.Exceptions. 除外情况12.4. Time. 保密期限12.5. Injunctive Relief. 寻求法院的禁令救济13. General Provisions. 一般性规定13.1. Entire Agreement. 协议的完整性13.2. Conflict. 订单与本协议不一致的处理13.3.Succession and Assignment. 权利义务的承继与转让13.4. Right to Setoff. 款项抵扣权13.5. Notices. 通知13.6. Designated Coordinators. 指定合作商13.7. Further Assurances. 其他保证13.8.No Waiver. 不放弃权利13....
