精品文档---下载后可任意编辑3D 芯片 TSV 互连的内建自测试及内建自修复技术的开题报告【摘要】随着集成度的不断提高，三维芯片的技术逐渐成熟。TSV（Through Silicon Via）互连技术是实现三维芯片互连的关键技术之一。在三维芯片设计中，内建自测试和内建自修复技术可以有效提高芯片的可靠性和稳定性。本文将探讨 3D 芯片 TSV 互连的内建自测试及内建自修复技术，以及其应用。首先介绍了 TSV 互连技术的基本原理和特点，然后讨论了内建自测试和内建自修复技术的实现方法和原理，最后通过分析实验结果，验证了内建自测试和内建自修复技术的可行性和效果，为 3D 芯片 TSV 互连技术的进一步进展提供了理论依据和实验基础。【关键词】三维芯片；TSV 互连；内建自测试；内建自修复【Abstract】With the constant improvement of integration, the technology of 3D chips is gradually becoming mature. TSV (Through Silicon Via) interconnect technology is one of the key technologies for realizing 3D chip interconnection. In 3D chip design, built-in self-test and built-in self-repair technology can effectively improve the reliability and stability of the chip. This article explores the built-in self-test and built-in self-repair technology of 3D chip TSV interconnect, and its application. Firstly, the basic principle and characteristics of TSV interconnection technology are introduced, then the implementation method and principle of built-in self-test and built-in self-repair technology are studied, and finally the feasibility and effect of built-in self-test and built-in self-repair technology are verified through experimental analysis, providing theoretical basis and experimental basis for the further development of 3D chip TSV interconnection technology.【Keywords】3D chip; TSV interconnect; Built-in self-test; Built-in self-repair
