L 电子行业工艺术语 surface mounted components/surface mounted devices (SMC/SMD) 表面组装元器件 surface mount technology (SMT) 表面组装技术 surface mounted assembly (SMA) 表面组装组件 reflow soldering 再流焊 hot air reflow soldering 热风再流焊 IR reflow soldering; infrared reflow soldering 红外再流焊 Reflow atmosphere 再流气氛 laser reflow soldering 激光再流焊 wave soldering 波峰焊 dual wave soldering 双波峰焊 beam reflow soldering 光束再流焊 vapor phase soldering (VPS)气相再流焊 assembly density 组装密度 terminations 焊端 lead foot; lead 引脚 fine pitch devices (FPD) 细间距器件 solder powder 焊料粉末 thixotropy 触变性:流遍体(流变体焊膏)的粘度随着时间、温度、切变力等因素而发生变化的特性
slump 踏落 no-clean solder paste 免清洗焊膏 adhesives 贴装胶 curing 固化 screen printing 丝网印刷 screen printing plate 网版 screen printer 丝网印刷机 stencil printing 漏版印刷 metal stencil; stencil (metal mask) 金属漏版 snap-off-distance 印刷间隙 flexible