芯片的封装技术已经历了好几代的变迁,从DIP、QFP、PGA、BGA 到 CSP 再到 MCM,技术指标一代比一代先进,包括芯片面积与封装面积之比越来越接近于 1,适用频率越来越高,耐温性能越来越好,引脚数增多,引脚间距减小,重量减小,可靠性提高,使用更加方便等等。 下面将对具体的封装形式作详细说明。 封装形式 塑封体尺寸 m m *m m *m m 引线间距 m m /m il 跨度 m m /m il DIP8L 9.25*6.35*3.3 2.54/100 7.62/300 DIP14L 19.1*6.35*3.3 2.54/100 7.62/300 DIP16L 19.1*6.35*3.3 2.54/100 7.62/300 DIP18L 22.9*6.5*3.3 2.54/100 7.62/300 DIP20L 26.23*6.55*3.3 2.54/100 7.62/300 DIP24L 31.76*13.8*3.85 2.54/100 15.24/600 DIP28L 37.05*13.8*3.85 2.54/100 15.24/600 DIP40L 52.25*13.8*3.85 2.54/100 15.24/600 DIP42L 52.25*13.8*3.85 2.54/100 15.24/600 HDIP12L 19.1*6.35*3.3 2.54/100 7.62/300 SDIP24L 22.9*6.55*3.3 1.778/70 7.62/300 SDIP28L 25.6*8.8*3.3 1.778/70 10.16/400 SIP8L 19.2*6.5*2.8 2.54/100 ___ SIP9L 22.3*5.6*3.2 2.54/100 ___ SIP10L 24.2*6.7*3.25 2.54/100 ___ HSIP12L 29.6*8.1*4 2.54/100 ___ ZIP16L 24.2*6.7*3.25 1.50/59 ___ SOP8L 4.9*3.9*1.38 1.27/50 5.72/225 SOP14L 8.65*3.9*1.38 1.27/50 5.72/225 SOP16L 9.9*3.9*1.38 1.27/50 5.72/225 SOP16L(W) 10.3*7.5*2.3 1.27/50 9.53/375 SOP20L 12.8*7.5*2.3 1.27/50 9.53/375 SOP24L 15.4*7.5*2.3 1.27/50 9.53/375 SOP28L 18.09*7.5*2.3 1.27/50 9.53/375 SOP30L 19*7.6*2.3 1.27/50 9.53/375 HSOP28L 18.9*7.5*2.3 0.8/31.5 9.53/375 SSOP10L(1) 4.9*3.9*1.38 1/39.3 3.9/153.5 SSOP16L 6.2*5.3*1.5 0.62/25.6 5.3/209 SSOP20L 7.2*5.3*1.5 0.62/25.6 5.3/209 SSOP24L 8.2*5.3*1.5 0.62/25.6 5.3/209 SSOP24L(1) 13*6*1.8 1/39.3 6/236 SSOP28L 10.2*5.3*1.75 0.62/25.6 5.3/209 TSOP44L 18.44*10.16*1 0.8/31.5 10.16/400 TSOP54L 22.2*10.16*1 0.8/31.5 10.16/400 QFP44L 10*10*2.1 0.8/31.5 _____ LQFP64L 14*14*1.4 0.8/31.5 _____ TO251(5L) 6.5*5.5*2.3 1.27/50 _____ TO252(5L) 6.5*5.5*2.3 1.27/50 _____ SOT89(3L) 4.5*2.5*1.5 1.5/59 _____ SOT223(...