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MitsubishiMaterialsCorporation資RF-07A512007/06/25MitsubishiMaterialsCorporationTHERMISTORSENSORS•OurElectronicComponents•OurThermistorBusiness•FeaturesofProducts•MainProductsMitsubishiMaterialsCorporation資RF-07A512007/06/25OurElectronicComponents•SurgeAbsorbersProtectionofelectronicequipmentfromtransienthighvoltagesuchasESDandinducedlightning.•Thermistors：ChipThermistors,ThermistorSensorsTemperaturedetection,temperaturecompensation.•NoiseFilters：LCFiltersForEMC.•ChipAntennasSurfacemountableantennaforcompactmobileequipment.SurgeAbsorbersChipThermistorsThermistorSensorsNoiseFiltersChipAntennasMitsubishiMaterialsCorporation資RF-07A512007/06/25ThermistorBusiness•ManufacturingLocations•SalesLocations•BreakdownofSalesQty/AmtbyApplicationMitsubishiMaterialsCorporation資RF-07A512007/06/25ManufacturingLocationsJapanCERAMICSPLANTLocation:Chichibu,Saitama,JapanDevelopment/DesignRawMaterialsandElementsSANKOELECTRONICSINDUSTRIALCO.,LTD.Location:Towada,Aomori,JapanProductionCapacity:2,500Kpcs/mthMMCELECTRONICSMALAYSIASDN.BHD.Location:Ipoh,Perak,MalaysiaProductionCapacity:6,000Kpcs/mthSANKOHVIETNAMCO.,LTDLocation:HoaBinh,VietnamProductionCapacity:1,500Kpcs/mthMMCELECTRONICSTHAILANDLTD.Location:Bangsaothong,Samutprakarn,ThailandProductionCapacity:500Kpcs/mthOverseasMitsubishiMaterialsCorporation資RF-07A512007/06/25SalesLocationsJapanTokyo,Nagoya,OsakaU.S.AKoreaTaiwanShanghaiHongKongThailandMalaysiaSingaporeMitsubishiMaterialsCorporation資RF-07A512007/06/25BreakdownofSalesQty/AmtbyApplicationRoomAirCon,34.0%BatteryPack,33.6%Bidet,10,2%InstantBoiler,6.4%CarAirCon,4.8%Others,2.5%ClinicalThermometer(onboard),2.3%Others(Automobile),1.9%Others（HeatingEquipment),1.2%Printer,3.1%Ratio(Amt)%RoomAirCon,34.1%Bidet,16.4%BatteryPack,15.3%CarAirCon13.0%InstantBoiler,9.4%Others,2.9%ClinicalThermometer(onboard),2.8%Others（HeatingEquipment),1.7%Others(Automobile),0.8%Printer,3.5%Ratio(Qty)%MitsubishiMaterialsCorporation資RF-07A512007/06/25FeaturesofProducts•Resistancetomigration•Excellentstabilityofcharacteristics•VarietyofproductslineupMitsubishiMaterialsCorporation資RF-07A512007/06/25Feature：StrongResistancetoMigration•Nodefectsbymigrationforover15yearsHigh-PurityResinCoating:ExclusionofionsthatcausemigrationDualCoatedStructure:PreventionofmoistureinfiltrationRinsingTechnology:ExclusionofionsthatcausemigrationHigh-PurityResinCoatingDualCoatedStructureRinsingTechnologyUsableforwet/humidplacewithsecurityMitsubishiMaterialsCorporation資RF-07A512007/06/2500.20.40.60.81.01.202004006008001000Time(hr)ResistancechangingrateΔR25（％）Feature：ExcellentStabilityofCharacteristics•Thechangeincharacteristicswithtimeisextremelysmallbecauseofoptimizedcompositionandstructureofthermistor.MMCproductOthercompanyproductChangeinresistanceonhightemperaturetest（125℃)(FH10：FlakeType)0.00.40.81.21.62.0010002000Numberofcycles（cycle）ResistancechangingrateΔR25（％）GlassencapsulatedproductofanothercompanyMMCproductGlassencapsulatedproductFlakeelementproductChangeinresistanceonheatcycletest（-40⇔125℃)MitsubishiMaterialsCorporation資RF-07A512007/06/25Feature：VarietyofProductsLineup•Variouselements/assembliesareavailableaccordingtoapplication.ThermistorElementsThermistorSensorsGlassencapsulatedtypeResincoatedtypeFlaketype/SMDtypeResincoatedtypeResincasingtypeMetalcasingtypeScrewterminalt...