1第二篇半导体工艺及器件仿真软件Silvaco操作指南主要介绍了半导体器件及工艺仿真软件Silvaco的基本使用。书中通过例程引导学习工艺仿真模块Athena和器件仿真模块Atlas，通过这两部分的学习可以使学习人员深入了解半导体物理的基本知识，半导体工艺的流程，以及晶体管原理的基本原理，设计过程，器件的特性。对于学习集成电路的制备及后道工序有一定的帮助。第一章SILVACO软件介绍....................................31.1程序启动.......................................................31.2选择一个应用程序例子..........................................41.3工艺模拟......................................................61.3.1运行一次模拟..............................................61.3.2渐进学习模拟..............................................61.3.3绘制结构..................................................71.3.4使用Tonyplot进行绘图.....................................71.3.5修正绘图的外观............................................71.3.6缩放及在图上进行平移......................................81.3.7打印图形..................................................91.4使用HISTORY功能...............................................91.5明确存贮状态.................................................101.6创建用于比较的两个结构文件....................................101.6.1存贮文件创建.............................................101.6.2文件交叠................................................111.7运行MOS工艺程序的第二部分...................................131.7.1`StopAt'功能...........................................131.7.2使用Tonyplot用于2-D结构.................................141.7.3使用Tonyplot来制备一轮廓图..............................151.7.4产生交互式图例...........................................161.8工艺参数的抽取...............................................181.8.1源漏结深.................................................181.8.2器件阈值电压.............................................191.8.3电导及偏压曲线...........................................191.8.4一些薄层电阻.............................................201.8.5沟道表面掺杂浓度.........................................211.9器件模拟.....................................................221.9.1器件模拟界面工艺.........................................221.9.2建立器件模拟............................................221.9.3执行器件模拟.............................................2321.9.4抽取器件参数.............................................23第二章电阻仿真及阻值抽取.................................24第三章扩散二极管仿真....................................332.1硼扩散.......................................................332.2进行MESH的实验...............................................382.3绘制杂质掺杂轮廓曲线.........................................392.4查看抽取结果.................................................40第四章NMOS电学特性仿真..................................423.1NMOS例子加载.................................................423.2TONYPLOT操作..................................................433.3查看电学仿真结果.............................................47第五章工艺流程的横断面观察...............................504.1初始化衬底....................................................504.2氧化层屏蔽...................................................504.3NWELL注入...................................................514.4PWELL注入.......................................
