COB技术简介VIP专享VIP免费

COB/COF技术简介目录目录一、名词解释二、各种类型摄像头板三、芯片的区别四、封装方式的区别五、wirebonding动态原理六、bondingPAD品质要求一、名词解释一、名词解释BGA:BallGridArray球栅阵列封装COB:ChipOnBoard芯片直接封装在线路板上COF:ChipOnFlex芯片直接封装在软板上平台层IT能力CT能力城市数据中心网络层通信网互联网物联网手机PC摄像头RFID传感器网络视频电话internet呼叫中心无线网关云计算感知层应急指挥应用层数字城管平安城市政府热线数字医疗环境监控数字物流智能交通二、各种类型摄像头板二、各种类型摄像头板BGACOBCOF软硬结合COB软硬结合COB+BGAHDIφ0.075mmVIA孔差分阻抗软硬结合COB+BGA三、所封装的芯片区别三、所封装的芯片区别BGACOB四、封装方式区别四、封装方式区别BGA使用锡球的方式封装COB采用wirebonding的方式五、五、COB/COFwirebondingCOB/COFwirebonding原理原理连接器手指BondingPAD电容pad马达驱动芯片焊接位置对焦马达连接padpadpadleadleadpadpadleadleadSEARCHHEIGHTpadpadleadleadpadpadleadleadSEARCHSPEED1SEARCHTOL1padpadleadleadSEARCHTOL1SEARCHSPEED1padpadleadleadSEARCHTOL1SEARCHSPEED1padpadleadleadSEARCHTOL1SEARCHSPEED1padpadleadleadSEARCHSPEED1SEARCHTOL1padpadleadleadSEARCHSPEED1SEARCHTOL1IMPACTFORCEpadpadleadleadheatheatPRESSUREPRESSUREUltraUltraSonicSonicVibrationVibrationpadpadleadleadUltraUltraSonicSonicVibrationVibrationheatheatPRESSUREPRESSUREpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadRHRHpadpadleadleadRD(ReverseDistance)padpadleadleadpadpadleadleadpadpadleadleadCalculatedWireLengthWIRECLAMP‘CLOSE’padpadleadleadCalculatedWireLengthpadpadleadleadSEARCHDELAYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadleadTRAJECTORYpadpadleadlead2ndSearchHeightSearchSpeed2SearchTol2padpadleadleadSearchSpeed2SearchTol2padpadleadleadSearchSpeed2SearchTol2padpadleadleadheatheatpadpadleadleadheatheatheatheatpadpadleadleadheatheatheatheatpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadTaillengthpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadleadpadpadleadlead通过演示图得知,在wirebonding过程中,PAD在向下压力、横向超声波作用力、高温几个因素下让金线与pad互融产生共晶,从而达到连接导通的目的。对PAD的要求与BGA迥然不同,也是两者品质要求的区别所在。客户的流程是在SMT贴好感光IC后开始打线,在打线时出现品质问题将会给公司造成巨大损失。以下重点讲解对BONDINGPAD品质要求。1打线时PAD凹陷命缺陷。三、三、bondingPADbondingPAD的品质要求的品质要求2bondingPAD上颗粒致命缺陷3bondingPAD压伤致命缺陷4bondingPAD露铜致命缺陷5bondingPAD镀层剥离致命缺陷6bondingPAD漏镀镍,镍层太薄不接收7bondingPAD漏镀致命缺陷0.001.002.003.004.005.006.007.008.009.0010.00keV04080120160200240280320360400440480CountsC-KSi-LSi-KNi-LNi-LNi-KNi-K3000倍下观察镍层EDSElementmass%C13.48O2.80Si1.77Ni81.95Total100.008金面氧化致命缺陷9pad上有油墨致命缺陷10油墨脱落致命缺陷11真性露铜致命缺陷12bonding面聚油目视能明显看见且影响到表面平整度的不接收13bondingPAD不允许有划伤Theend