制程技术与材料分析工程目录1.產品設計之可製造性(DFM)作業...............................................................31.1.何謂 DFM..................................................................................................31.2.DFM 使用時機............................................................................................31.3.DFM 的作業流程（圖 1）.............................................................................31.4.DFM 檢核表之訂定與使用............................................................................31.5.關鍵性的 PCB DFM 準則..............................................................................32.材料選用..........................................................................................32.1. – 間接材料選擇錫膏選擇.............................................................................32.2.間接材料的選用準則-助焊劑..........................................................................32.3. – 直接材料的選用準則印刷電路板 (PCB).......................................................32.4. – 直接材料的選用準則元件..........................................................................33.PCBA 製程管制準則............................................................................33.1.材料儲存與取用..........................................................................................33.1.1. 溼氣敏感元件..........................................................................................33.1.2. 印刷電路板.............................................................................................33.1.3. 錫膏材料................................................................................................33.2.SMT 製程參數之制定準則.............................................................................33.2.1. 錫膏印刷................................................................................................33.2.2. 印刷機作業流程 (Operation Flow)....................
