【印制线路板术语中英对照简表】排序英语简称Accelerate Aging加速老化Acceptance Quality Level(AQL)Acceptance TestAccess HoleAnnular RingArtworkArtwork MasterBack Light背光法Base Material基材Base Material thicknessBland ViaBlisterBoard thicknessBonding LayerC-Staged ResinChamfer (drill)Characteristic ImpendenceC-Staged ResinChamfer (drill)Characteristic ImpendenceCircuitCircuit CardCircuitry LayerCircumferential SeparationCreak裂痕Crease皱褶Date Code周期代码Delamination Delivered Panel(DP) DentDesign spacing of ConductiveDesmear除污Dewetting缩锡Dimensioned HoleDouble-Side Printed Board双面板ABCDDrill body lengthEEyelet铆眼Fiber Exposure纤维暴露Fiducial Mark基准记号FlairFlammability Rate燃性等级Flame Resistant耐燃性Flare扇形崩口Flashover闪络Flexible Printed Circuit,FPC 软板Flexural Strength抗挠强度Flute退屑槽Flux阻焊剂GAPGerber Data，GerBerFile格式档案Grid标准格Ground Plane接地层Grand Plane Clearance 接地层的空环Haloing白圈Hay wire 也称Jumper Wire.Heat Sink Plane散热层Hipot Test即High PostentialTest高压测试HookHole breakout 破孔Hole location孔位Hole pull StrengthHFGHole Void 破洞Hot Air Leveling热风整平Hybrid Integrated CircuitIcicle锡尖I.C SocketImage Transfer图象转移Immersion Plating浸镀Impendent阻抗Impendent Control 阻抗控制Impendent Match阻抗匹配InclusionIndexing HoleInspection Overlay底片Insulation ResistanceIntermatallic Compound(IMC) 介面合金共化物Internal StressIonizable（Ionic）Contaimination 离子性污染IPC The Institute forInterconnecting and PackingElectronic CircuitJEDEC Joint ElectronicDevice Engineer CouncilJ-LeadJumoer WireJust-In-Time(JIT) 适时供应Keying SlotKiss Pressure吻压Kraft Paper牛皮纸Laminate基材Laminate Void板材空洞LandLandless Hole无环通孔IJKLaser Direct Imaging LDI雷射直接成像Lay Back刃角磨损Lay OutLay Up排版Layer to Layer Spacing Lead引脚Margin刃带MarkingMaskMounting Hole安装孔Multiwiring Board复线板Nail Heading钉头Negative EtchbakNe...
