1.Isotropic Condu ctiv e Adhesiv esICAs2.Anisotropic Condu ctiv e Adhesiv esACAsTFTLiqu id Cry stal DisplayLCDIndiu m Tin Ox ideITOTCPInterconnection Condu ctiv e Adhesiv eflake20-35 Organic SolderHeat SinkGrou nding2ALIVHB itElasticityStyrene AcrylicCompressionRepulsion0.05ACAsB-stageZAF3MACF2mil/2milFlip ChipLCDACFSony TorayHitachi ChemicalSamsong3MLCDDriver ICITOACF UnderfillACFAnisotropic Conductive FilmChip on GlassCOGChip on Flex COFChipAdhesiveParticleBoardChipBoardAdhesiveParticle0Bonding temperature:180 CBonding time: 20sACF filled with Aucoated polymer spheresBonding pressure(kgf/mm )Contact resistance(mW)Citcuit 1Circuit 2Indu ctanceLeadsCell phonePDAPoly py rroleTgGlass Transition Temperatu rePVCPETgEpox iesSiliconesCrosslinkingRev ersibleA-stageB-Stage30303.Intrinsically Condu ctiv e Adhesiv e1.Thermoplastic Adhesiv es2.Thermosetting Adhesiv esNHNHNHNHNHNHNHNHNHNHNHNH2nHe2e(2n-1)e2HpP =Doping AnionseBrittleness Elastomeric Network Hybrids FR-4PolyestersPolyimides1948 Silver ElectromigrationVolume fractions of conducting particles(vol%)THERMOPLASTICTHERMOSET(3D Netw ork)CROSS-LINKS5. (Crosslinks)(Thermoplastic) (Thermoset)In X-Y planeIn Z direction0.5Resin0 .5ACFElastomer, COFCOGACF2MHzAC20mAACF20Sony(Toray)CP1030CalculatorPressure Sensitive AdhesiveMember SwitchesPitch800 m32mil2000TP-1141150 m2milBare ChipFlip ChipChip on Board or Direct Chip AttachSony ACF203.1 ACF3.2LCDLiqu id Cry stalNematic LCD90 ITOColor FitlerRGBDisplayLCDTNTwisted NematicLCDSTNSupper Twisted NematicLCD Thin Film TransistorTFT1521TFT-LCDMonitorLGSamsung47LCDITO10 ohms31510248IC7683IC2000FR-4ACF TFF-LCDModu le FR-4TABTape Au tomatic BondingTCPTape Carrier PackagingInner LeadICILBOu ter LeadACFITOACFENIGENIGTABICTABTABWUSLCDLCD panelACF filled with Ni/Aucoated polymer spheresTABICchipMetal electrodeACF filled with Ni particlesPCBITO el...
