The Nordic Electronics Packaging Gu idelineChapter A: Wire Bonding1LIST OF CONTENTS1. LEVEL 1. INTRODUCTION OF WIREBONDING TECHNOLOGY...............................................................21.1 WHAT IS WIREBONDING.......................................................................................................................................21.1.1 Wirebonding processes................................................................................................................................21.1.2 Wirebond forms...........................................................................................................................................21.3 HISTORY AND APPLICATIONS................................................................................................................................31.4 COST..................................................................................................................................................................31.5 LIMITATION OF WIREBONDING.............................................................................................................................42 LEVEL 2. CONCLUSIONS AND GUIDELINE...................................................................................................42.1 WIREBONDING TECHNIQUES...............................................................................................................................42.1.1 Ball bonding................................................................................................................................................42.1.2 Wedge bonding............................................................................................................................................52.2 WIRES AND TYPICAL METALLURGICAL SYSTEMS....................................................................................................52.2.1 Wires usually used in wirebo...
