SMT检验标准PCBA样本

下载后可任意编辑检验项目:A-1 零件脚吃锡不足 SOP QFP (Inspection Item: A-1 Insufficient Solder SOP QFP Lead)允收标准(Accept Standard)吃锡应该达零件脚长的 1/2 以上及需有爬锡的状況 Side joint length (D) is more than 50% of lead length(L).拒收标准(Reject Standard)吃锡未达脚长 1/2 以上Side joint length (D) is less than50% of lead length(L) .下载后可任意编辑检验项目: A-2 零件脚吃锡不足 PLCC SOJ (Inspection Item: A-2 Insufficient Solder PLCC SOJ Lead)允收标准(Accept Standard)吃锡高度(F)＞＝零件脚厚度(T) 的 1/2＋焊接物(G) Heel fillet height(F) more than solder thickness(G) plus 50% Lead thickness(T)拒收标准(Reject Standard)吃锡高度(F)<零件脚厚度(T)的 1/2+焊接物(G)Heel fillet height(F)less than solder thickness(G) + 50% lead thickness(T)下载后可任意编辑检验项目:A-3 零件偏移 SOP QFP (Inspection Item:A-3 Component Shift SOP QFP ) 允收标准(Accept Standard)偏移: 1.零件脚(W)超出 PCB 不可超过本体宽度的 1/4Component lead shift off the pad,ut not exceed 1/4 width of lead width (W) 2.对于尺寸小于 0.5mm 之 QFP 零件偏移量不可超过本体宽度的 1/2.The QFP component lead of pitch less than 0.5mm shift off the pad, but not exceed 1/2 width of lead width .拒收标准(Reject Standard)1.零件偏离焊垫且零件与焊垫接触面积(C)占零件本体宽度(W)的 3/4 以下. Component lead shift off the pad andcontact the pad less than3/4 width of lead width(W)下载后可任意编辑检验项目:A-4 零件偏移 PLCC SOJ (Inspection Item: A-4 Component Shift)允收标准(Accept Standard)零件脚超出 PCB(A)不可超过本体 1/4(W) Component Lead shift off the pad, but not exceed 1/4 width of Lead area(W). 拒收标准(Reject Standard)零件偏离焊垫且超出本风光积 1/4(W).Component Lead shift off the pad andexceed 1/4 width of Lead area(W)下载后可任意编辑检验项目:A-5 零件偏移 (Inspection Item:A-5 Component shift)允收标准(Accept Standard)零件位於焊垫中心点. Compon...