元器件降额规范 文 件编号 文件版本 制定部门 制定日期 页 码 目 录 1 目的 ....................................................................................2 2 适用范围 ................................................................................2 3 引用标准.................................................................................2 4 质量等级及工作状态定义 ..................................................................2 4.1 质量等级...............................................................................2 4.2 工作状态.............................................................................. 2 5 各类器件降额度要求 ......................................................................3 5.1 集成电路.............................................................................. 2 5.2 分立半导体器件.........................................................................4 5.3 固定电阻器、保险丝、热敏电阻.......................................................... 5 5.4 电位器................................................................................ 5 5.5 电容器.................................................................................6 5.6 磁性器件...............................................................................7 5.7 机电元件...............................................................................8 5.8 连接器、电缆...........................................................................8 5.9 风扇、PCB .............................................................................9 6 应用说明.................................................................................9 6.1 半导体器件结温 Tj 确定...................................................................9 表目录 表1 集成电路降额表......................... ....... .......................................3 表2 分立半导体降额表............................. .........................................4...
