各种 IC 封装形式图片BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LQFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPin GridArrayDIPDual InlinePackageSOJ32LSOJSOPEIAJTYPEII 14LSOT220SSOP16LSSOPTO18DIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO220FlatPackHSOP28ITO220TO220TO247TO264TO3TO5TO52TO71ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayTO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackagePLCC详细规格PQFPPSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig-ZagInlinePackageTEPBGA288LTEPBGAC-BendLeadSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343CERQUADCeramicQuad FlatPack详细规格CeramicCaseLAMINATECSP 112LChip ScalePackage详细规格Gull WingLeadsLLP 8La详细规格PCI 32bit5VPeripheralComponentInterconnect详细规格PCI 64bit3.3VSOT523SOT89SOT89Socket 603FosterLAMINATETCSP20LChipScalePackageTO252PCMCIAPDIPPLCC详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineTO263/TO268SO DIMMSmall OutlineDual In-lineMemory ModuleSOCKET 370For intel 370 pinPGA Pentium III& Celeron CPUSOCKET 423For intel 423 pinPGA Pentium 4CPUSOCKET462/SOCKET AFor PGA AMDAthlon & DuronCPUSOCKET 7For intel Pentium& MMX PentiumCPUSLOT 1For intelPentium IIPentium III& CeleronCPUSLOT AFor AMDAthlon CPUSNAPTKSNAPTKSNAPZPSOH各种封装缩写 说 明BGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlat PackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-70 5LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANCANCANTO8TO92CANCANTSOPTSSOP or TSOPBGABGAZIPPCDIP以下封装形式未找到相关图片，仅作简易描述，供参考：DIM 单列直插式，塑料例如：MH88500QUIP蜘蛛脚状四排直插式，塑料例如：NEC7810DBGABGA 系列中陶瓷芯片例如：EP20K400FC672-3CBGABGA...
