常见封装形式简介 DIP = Dual Inline Package = 双列直插封装 HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装 SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装 SIP = Single Inline Package = 单列直插封装 HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装 SOP = Small Outline Package = 小外形封装 HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装 eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装 SSOP = Shrink Small Outline Package = 紧缩型小外形封装 TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装 TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装 PQFP = Plastic Quad Flat Package = 方形扁平封装 LQPF = Low Profile Quad Package = 薄型方形扁平封装 eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装 DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装 QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装 TO = Transistor package = 晶体管封装 SOT = Small Outline of Transistor = 小外形晶体管 BGA = Ball Grid Array = 球栅阵列封装 BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装 CAD = Computer Aided Design = 计算机辅助设计 CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列 CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列 CSP = Chip Size Package = 芯片尺寸封装 DFP = Dual Flat Package = 双侧引脚扁平封装 DSO = Dual Small Outline = 双侧引脚小外形封装 3D = Three-Dimensional = 三维 2D = Two-Dimensional = 二维 FCB = Flip Chip Bonding = 倒装焊 IC = Integrated Circuit = 集成电路 I/O = Input/Output = 输入/输出 LSI = Large Scale Integrated Circuit = 大规模集成电路 MBGA = Metal BGA = 金属基板 BGA MCM = Multichip Module = 多芯片组件 MCP = Multichip P...
