最全的芯片封装方式大全各种 IC 封装形式图片LBGA160LPBGA217LPlasticBallGridArrayEBGA680LQFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlineuPackageSOSmallOutlinePackageSOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LSSOPSTO-220TO18tabTO78LDCCLGALQFPUuuTO99TSOPThinSmallOutlinePackagePQFPPSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackage详细规格TSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArray■■j-yt1PCCVQtDH«t>■QA.■B.0~VVl»1>■_K«JL■・■m>cn>0、■■QPSF■VV*«b«-rtvr*4«*«uBGAMicroBallGridArrayZIPZig-ZagInlinePackageTEPBGA288LTEPBGAC-BendLeadCERQUAMCeramicQuadFlatPack详细规格CeramicCaseLAMINATECSP112LChipScalePackage详细规格GullWingLeadsLLP8La详细规格PCI32bit5VPeripheralInterconnect详细规格liJlUlltII.4IIUII..IIIAillUII-IIIUliai.—IIL-ii..II1IS........■PCI64bit■.■■rim■■-■■■■■■■■■■■■!■IIUIIU■■■■■■■■>■■imisiiiuiiiiiaiiiuiii-iiii-i13.3VSODIMSmallOutliDualIn-MemoryModuleCPSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumSO各种封装缩写说明fiBGABQFP132XA"Xw.r.G?■画■一U*■■■--圍百・■■・*-.•血■W■■■・・■II«JPIL■■Ptv|•.».■■.■.:・直-!-»BGABGABGABGADIPDIP-tabBGADIPFTO-220TOFlatPackHS0P28H5OP-2STOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-705LDIPSIPSOSOHSOJSOPTOSTO-22OSOPSOPCANTOCANTOTOTO3CANCANCANCANCANTO8ILI-N?TO92CANBGpfc>■r ■i*1V■■■ e■■EeV-T«■«-*H-■Q■cV■C沖bt-0101口4书«F ■r■111TSOPTSSOPorTSOPBGAZIP2APCDIP以下封装形式未找到相关图片，仅作简易描述，供参考：例如：MH88500例如：NEC7810例如：EP20K400FC672-3例如：EP20K300EBC652-3例如：LH0084例如：EPF10KRC 系列DIMM 电路正面或背面镶有 LCC 封装小芯片，陶瓷，双列直插式例如：X28C010DIP-BATTERY 电池与微型芯片内封 SRAM 芯片，塑料双列直插式例如：达拉斯 SRAM 系列（五）按用途分类集成电路按用途可分为电视机用集成电路。音响用集成电路、影碟机用集成电路、录像机用集成电路、电脑（微机）用集成电路、电子琴用集成...
