目 录1 概述............................................................................................................................11.1 简述..................................................................................................................11.2 温度控制系统的目的......................................................................................12 系统主要元器件介绍................................................................................................22.1 单片机的选用及功能介绍..............................................................................22.2 DS18B20 温度传感器介绍.............................................................................43 总体设计方案............................................................................................................83.1 设计原则..........................................................................................................93.2 引脚连接..........................................................................................................93.2.1 晶振电路...............................................................................................93.2.2 串口引脚.............................................................................................103.3 显示部分........................................................................................................103.4 温度采集部分................................................................................................104 系统整体设计...........................................................................................................114.1 系统硬件电路设计........................................................................................114.1.1 主板电路设计.....................................................................................114.1.2 各部分电路.........................................................................................114.2 系统软件设计.............
