模块制程之精实流程改善--以光电模块及 IC 测试为例Lean Process Improvement for Module Processes- Using Optronics Module and IC Testing as Examples摘要...............................................................................3图目录............................................................................7表目录............................................................................8第一章.....................................................................................绪论91.1..............................................................................研究背景91.2..............................................................................研究目标111.3 研究范围和限制..................................................................121.4 研究方法与流程................................................................12第二章..............................................................................文献探讨132.1 组立和模块制程连结的特性............................................132.2 流程的定义和内涵............................................................162.2.1 企业流程再造(Business Process Reengineering, BPR)..............................................................162.2.2 企业流程改善(Business Process Improvement , BPI)............................................................................................202.2.3 持续改善(Continuous Improvement , CI) (Kaizen)....................................................................................222.3 精实生产(Lean Production)..........................................252.3.1 精实生产的沿革(Evolution of Lean production )..................................................................................................262.3.2 精实生产包含的元素(Elements of Lean Production )............................................................................312.3.3 比较丰田式生产系统和精实生产的差别.............342.3.4 精实流程改善............................
