一.TFT工艺流程中英文标准名称ArrayProcessFlow阵列段工艺流程Input投料Unpacking拆包装Initialclean预备清洗Particlecount尘埃粒子测试Gate栅电极层Cleanbeforedepo成膜前清洗Gate(Mo/Alalloy)Filmdepo栅电极成膜RSmeter电阻测量MacroInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry(VCD)光刻胶低压干燥PRsoftbake前烘Expose曝光TitlerExpose/EdgeExpose打标/边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Mic/MacInspection宏微观检查CDafterdevelop显影后关键尺寸检查Totalpitch长寸测量GateWetetch栅电极湿刻Contactangle接触角测量PRstrip光刻胶剥离CDafteretch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查LaserRepair激光修补Active层Cleanbeforedepo成膜前清洗ActivefilmdepoActive成膜AOI自动光学检查MacroInspection宏观检查ThicknessMeasurement厚度测量CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Mic/MacInspection宏微观检查ActivefilmDryetch&AshingActive膜干刻与灰化ThicknessMeasurement厚度测量P