线路板流程术语中英文对照VIP免费

第1页共54页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第1页共54页线路板流程术语中英文对照流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A.开料(CutLamination)a-1裁板(SheetsCutting)a-2原物料发料(Panel)(ShearmaterialtoSize)B.钻孔(Drilling)b-1内钻(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射钻孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)C.干膜制程(PhotoProcess(D/F))c-1前处理(Pretreatment)c-2压膜(DryFilmLamination)c-3曝光(Exposure)c-4显影(Developing)c-5蚀铜(Etching)c-6去膜(Stripping)c-7初检(Touch-up)c-8化学前处理,化学研磨(ChemicalMilling)第2页共54页第1页共54页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第2页共54页c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)c-10显影(Developing)c-11去膜(Stripping)Developing,Etching&Stripping(DES)D.压合Laminationd-1黑化(BlackOxideTreatment)d-2微蚀(Microetching)d-3铆钉组合(eyelet)d-4叠板(Layup)d-5压合(Lamination)d-6后处理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)e-1薄化铜(CopperReduction)F.电镀(HorizontalElectrolyticPlating)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)f-3低于1mil(Lessthan1milThickness)f-4高于1mil(Morethan1milThickness)第3页共54页第2页共54页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第3页共54页f-5砂带研磨(BeltSanding)f-6剥锡铅(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2预烤(Precure)g-3表面刷磨(Scrub)g-4后烘烤(Postcure)H.防焊(绿漆/绿油):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3静电喷涂(SprayCoating)h-4前处理(Pretreatment)h-5预烤(Precure)h-6曝光(Exposure)h-7显影(Develop)h-8后烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11喷砂(Pumice)(WetBlasting)h-12印可剥离防焊(PeelableSolderMask)第4页共54页第3页共54页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第4页共54页I.镀金Goldplatingi-1金手指镀镍金(GoldFinger)i-2电镀软金(SoftNi/AuPlating)i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)J.喷锡(HotAirSolderLeveling)j-1水平喷锡(HorizontalHotAirSolderLeveling)j-2垂直喷锡(VerticalHotAirSolderLeveling)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.开短路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)第5页共54页第4页共54页编号：时间：2021年x月x日书山有路勤为径，学海无涯苦作舟页码：第5页共54页M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)m-4目检(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6护铜剂(ENTEKCu-106A)(OSP)m-7离子残余量测试(IonicContaminationTest)(CleanlinessTest)m-8冷热冲击试验(ThermalcyclingTesting)m-9焊锡性试验(SolderabilityTesting)N.雷射钻孔(LaserAblation)N-1雷射钻Tooling孔(LaserablationToolingHole)N-2雷射曝光对位孔(LaserAblationRegistrationHole)N-3雷射Mask制作(LaserMask)N-4雷射钻孔(LaserAblation)N-5AOI检查及VRS(AOIInspection&Verified&Repaired)N-...