4层板PCB排版结构L1(TOPLAYER)1
9mil2116+10807
3mil(介电常数:4
3)L2(GND)1
2milCore61milL3(VCC)1
2mil2116+10807
3mil(介电常数:4
3)L4(BOTTOMLAYER)1
9mil说明:L1、L4为信号层,L2、L3为电源层;总厚度:79
0254=2
0mm差分线宽6mil,5mil间距,阻抗值100欧姆;差分线宽5mil,4mil间距,阻抗值100欧姆差分线宽7mil,6
5mil间距,阻抗值100欧姆二.六层板叠层顺序TOP-------------------------------1
9mil21164
5milGND-------------------------------1
2milCore8
27milS1---------------------------------1
2mil7628*2+211616
9milVCC--------------------------------1
2milCore37
4milVDD--------------------------------1
2mil21164
5milBOT----------------------------------1
9mil总厚度:78*0
0254=2
0mm外层线路:单端线6mil54Ω;单端线4mil65Ω;差分线6mil线宽16mil间距100Ω
第三层:单端线6
0mil56Ω;单端线4mil68Ω差分线6mil线宽10mil间距100Ω
八层板叠层顺序TOP-------------------------------1
9mil1080*27
3milGND-------------------------------1
2milCore20
08milS1