各种 IC封装形式图片 BGA Ball Grid Array EBGA 680L LBGA 160L PBGA 217L Plastic Ball Grid Array SBGA 192L TSBGA 680L CLCC QFP Quad Flat Package TQFP 100L SBGA SC-70 5L SDIP SIP Single Inline Package SO Small Outline Package CNR Communication and Networking Riser Specification Revision 1
2 CPGA Ceramic Pin Grid Array DIP Du al In lin e Package DIP-tab Dual Inline Package w ith Metal Heatsink FBGA FDIP FTO220 SOJ 32L SOJ SOP EIAJ TYPE II 14L SOT220 SSOP 16L SSOP TO18 Flat Pack HSOP28 ITO220 ITO3p JLCC LCC LDCC LGA TO220 TO247 TO264 TO3 TO5 TO52 TO71 LQFP PCDIP PGA Plastic Pin Grid Array PLCC PQFP PSDIP LQFP 100L TO72 TO78 TO8 TO92 TO93 TO99 TSOP Thin Small Outline Package METAL QUAD 100L PQFP 100L QFP Quad Flat Package SOT220 SOT223 SOT223 SOT23 TSSOP or TSOP II Thin Shrink Ou tline Package uBGA Micro