PCB 工艺设计规范 _____________________________________________________________________________________修订信息表版本修订人修订时间修订内容目 录前 言............................................................................................................................................51 目 的.........................................................................................................................................................62 适用范围.....................................................................................................................................................63 引用/参考标准或资料................................................................................................................................64 名词解释.....................................................................................................................................................65 规范简介.....................................................................................................................................................76 规范内容.....................................................................................................................................................76.1 基板规格..........................................................................................................................................76.2 层间结构设计..................................................................................................................................76.2.1 层间结构...............................................................................................................................76.2.2 半固化片规格.......................................................................................................................86.2.3 板厚.......................................................................................................................................86.2.4 板厚公差.....