Pad Designer（Cadence 焊盘制作） 1.打开软件........................................................................................................................................ 3 1.Pad Designer（用于制作过孔、表贴、通孔焊盘） ...................................... 3 2.PCB Editor（用于制作Flash 热风焊盘，PCB 封装库） ................................ 4 2.焊盘的制作 ................................................................................................................................... 6 1.热风焊盘的制作（Flash） ................................................................................................... 6 2.通孔焊盘制作 ....................................................................................................................... 7 3.贴片焊盘制作 ....................................................................................................................... 8 4.过孔的制作 ......................................................................................................................... 10 5.MARK 点的制作 .................................................................................................................. 12 3.修改添加器件焊盘、PCB 封装、MARK 点、过孔库路径 ....................................................... 14 4.元件封装的制作 ......................................................................................................................... 15 1.打开PCB Editor软件 ......................................................................................................... 15 2.创建元器件封装 .................................................................................................................. 15 3.设置图纸尺寸 ...................................................................................................................... 16 4.设置格点 ..........................................................................................................
