光刻工艺流程VIP免费

学习文档 仅供参考 光刻工艺流程 Lithography Process 摘要：光刻技术〔lithography technology)是指集成电路制造中利用光学—化学反应原理和化学，物理刻蚀法，将电路图形传递到单晶外表或介质层上，形成有效图形窗口或功能图形的工艺技术。光刻是集成电路工艺中的关键性技术，其设想源自于印刷技术中的照相制版技术。光刻技术的发展使得图形线宽不断缩小，集成度不断提高，从而使得器件不断缩小，性能也不断提利用高。还有大面积的均匀曝光，提高了产量，质量，降低了成本。我们所知的光刻工艺的流程为：涂胶→前烘→曝光→显影→坚膜→刻蚀→去胶。 Abstract:Lithography technology is the manufacture of integrated circuits using optical - chemical reaction principle and chemical, physical etching method, the circuit pattern is transferred to the single crystal surface or the dielectric layer to form an effective graphics window or function graphics technology.Lithography is the key technology in integrated circuit technology, the idea originated in printing technology in the photo lithographic process. Development of lithography technology makes graphics width shrinking, integration continues to improve, so that the devices continue to shrink, the performance is also rising.There are even a large area of exposure, improve the yield, quality and reduce costs. We know lithography process flow is: Photoresist Coating → Soft bake → exposure → development → hard bake → etching → Strip Photoresist. 关键词：光刻，涂胶，前烘，曝光，显影，坚膜，刻蚀，去胶。 Key Words:lithography,Photoresist Coating,Soft bake,exposure,development,hard bake ,etching, Strip Photoresist. 引言： 学习文档 仅供参考 光刻有三要素：光刻机；光刻版〔掩模版〕；光刻胶。光刻机是IC 晶圆中最昂贵的设备，也决定了集成电路最小的特征尺寸。光刻机的种类有接触式光刻机、接近式光刻机、投影式光刻机和步进式光刻机。接触式光刻机设备简单，70 年代中期前使用，分辨率只有微米级，掩模板和硅片直接接触，使得掩膜版寿命短。...