包装印刷印刷基板实装判定基准知识概述VIP免费

共同部品检查基准书管理NOBMHK-B-Q105REV:01名称印刷基板实装判定基准号日期页次经历承认确认担当012006/12/2131新版制定余广胜BMHK-B103-A页:1/31印刷基板实装判定基准管理NOBMHK-B-Q105REV:01页:2/41目录及页码构成1.目的················································································32.适用范围···········································································33.管理责任者及管理部署···························································34.专业用语的说明···································································35.判定基准···········································································55.1.基板外观·················································································55.2.插入(带脚)部品的实装······························································115.3.插入(带脚)部品的焊接作业························································205.4.表面实装部品的实装··································································255.5.表面实装部品的焊接作业···························································27BMHK-B104-A印刷基板实装判定基准管理NOBMHK-B-Q105REV:01页:3/411.目的通过明确印刷基板实装的品质规格和品质基准，来确保印刷基板的实装品质，特制订本基准。2.适用范围(1)适用于柯尼卡美能达商用科技股份有限公司购入基板组装件。但是，图纸上有规定时，应优先按图纸规定执行。(2)ＯＥＭ产品,依照与ＯＥＭ厂方的相关协议決定的基准执行、没有要求的场合按本基准执行。(3)因設計上或製造上问题，不能按本基准执行时，应和供应商协调、調整设定个別基准以便应用执行。（4）当《劳动安全卫生法》、《环境公害基准》、《各种安全规格》等相关法规有规定时，优先遵守相关法规。3.管理责任者及管理部署本基准的管理部署为：生产本部制品化中心的电气部品担当部署；责任者为G长（课长）。4.专业用语的说明（1）导体线路以電气的导通为目的的印刷配线形成的回路部分。(2)带孔焊盘为了部品脚与基板的连接，以及导体层相互间的连接，在孔的周围設计的特定用来焊接的导体部分。(3)SMD部品焊盘为焊接表面贴装部品脚或电极,而设计的导体部分。(4)导孔（通孔）导体层相互间的电气连接孔、孔的内部有镀铜的、也有灌銀处理的等。(5)焊锡保护层(绿油)为了防止导体回路的腐蚀及不要焊锡的地方焊上锡，在其表层塗上一层树脂类的膜层。通常称之为绿油。(6)连接脚为了与基板连接而外露的电子部品的导体部分，即零件脚。(7)焊接层焊接时,焊锡在相应的焊盘形成的像裙摆状似的，呈展开状的焊接状态。(8)助焊剂去除焊盘表面的氧化物，促进焊锡在焊盘上的扩散。通过助焊剂中的活性剂与铜表面的氧化物反应来去除酸化物。锡膏中助焊剂的作用：去除锡膏中焊锡粒子表面的氧化物，予热时覆盖在金属表面，抑制氧化，使金属的焊锡粒子能够在膏状下达到印刷的目的。(9)焊锡连桥（连锡）基板回路上的相邻导体间被焊锡连接而形成（短路）的状态.(10)起泡由于受热造成基板相应的扭曲变形,絶縁基板中的玻璃纤维中纤维目里的树脂发生脱离...