Title:WaferSawStandardOperationProcedureDocumentNumber:3745-01-40001Revision:31SanDiskConfidentialPage1of27Warning:ThisdocumentisUNCONTROLLEDandshouldnotberelieduponunlessobtaineddirectlyfromtheAgileDocumentControlSystemTODAY
0Purpose目的ThepurposeofthisprocedureistoestablishwafersawstandardoperationforSDSSproducts
本规范的目的是建立SDSS晶圆切割工序程序书
0Scope范围ThisprocedureisappliedforSDSSproducts
本规范仅适用于所有SDSS的产品
0RolesandResponsibilities角色和职责3
1Primaryownerdepartment:ProcessEngineering拟定部门:工艺工程部3
2Review,approvalandimplementationdepartment(s):Q&RDepartment,ProcessEngineering,ProductionDepartment,EquipmentMaintenanceDepartment
评审,批准和执行部门:质量部,工艺工程部,生产部,设备维护部4
0ReferenceDocuments参考文件No
编号Source来源Title/Description标题/描述1111-02-20001AgileProcessControlPlan3712-02-00017AgileInternalVisualInspectionCriter