倒装芯片封装技术培训教程..........................................................2一、导论..........................................................................21.1封装技术概述..............................................................21.2倒装芯片封装技术简介......................................................31.3培训教程的目标与内容......................................................5二、倒装芯片封装技术基础..........................................................62.1倒装芯片的基本概念........................................................62.2封装材料与技术分类........................................................82.3工艺流程简介..............................................................9三、倒装芯片封装工艺详解.........................................................103.1前期准备与芯片检测.......................................................103.2焊接工艺参数设定.........................................................123.3焊接过程中的质量控制.....................................................133.4封装后的检测与评估.......................................................15四、设备操作与维护...............................................................164.1封装设备的操作规范.......................................................164.2设备日常维护与保养.......................................................184.3设备故障排查与处理.......................................................20五、质量控制与可靠性测试.........................................................225.1质量标准与检测指标.......................................................225.2可靠性测试方法...........................................................245.3不合格品的处理与预防.....................................................25六、实践与操作训练...............................................................276.1实践操作前的准备.........................................................276.2操作步骤演示与实操.......................................................286.3操作训练...
